Good day to everyone who reads this blog. I have started this
informal communication with you to reach out to people who are
interested in engineering surfaces, and want to find out what
atmospheric pressure plasmas can do for them. I am presenting this
material with my hat on as Senior Vice President at Surfx Technologies, a
subsidiary of Precision Mechatronics Pty Ltd. Over the years, I have
learned that people have a lot of questions concerning the use of
plasmas to manufacture commercial products.
The main questions are: (1) what are the principal applications of
plasmas in manufacturing; (2) how do I know which plasma to choose from
the many types on the market, and (3) why would I select plasma over
other types of surface treatment, such as abrasion, solvent wiping, or
chemical etching. Over the coming months I am going to take a shot at
answering these questions. I encourage readers of my blog to ask me
questions, or select topics that they would like me to discuss in the
areas of surfaces and plasma processing. I sincerely hope you find this
helpful as well as enjoyable to read.
Definition of Plasma
Before I start, let’s make it clear that we are talking about an ionized gas, and not a component of blood. If you’re interested in blood, you’ve come to the wrong website. An ionized gas, or plasma (or alternatively, a gas discharge), is comprised of free electrons, negatively and positively charged ions, and neutral molecules. Plasmas can be created many ways, but the most common method is through the application of a sufficient voltage to strip electrons away from the neutral molecules, thereby ionizing the gas. Plasmas conduct electricity, consume power (watts), and are sustained by the application of an electric potential (volts) and current (amps).
Before I start, let’s make it clear that we are talking about an ionized gas, and not a component of blood. If you’re interested in blood, you’ve come to the wrong website. An ionized gas, or plasma (or alternatively, a gas discharge), is comprised of free electrons, negatively and positively charged ions, and neutral molecules. Plasmas can be created many ways, but the most common method is through the application of a sufficient voltage to strip electrons away from the neutral molecules, thereby ionizing the gas. Plasmas conduct electricity, consume power (watts), and are sustained by the application of an electric potential (volts) and current (amps).
Applications of Plasma in Manufacturing
The principal applications of plasma in manufacturing are for making functional materials and surfaces. Plasmas come in contact with materials at their surfaces. Any change in material function must proceed through processes that occur at the surface. The important applications are therefore:
The principal applications of plasma in manufacturing are for making functional materials and surfaces. Plasmas come in contact with materials at their surfaces. Any change in material function must proceed through processes that occur at the surface. The important applications are therefore:
(1) Cleaning, i.e., contaminant removal.
(2) Activation for wetting, i.e., adjustment of the surface energy.
(3) Activation for adhesion.
(4) Sterilization.
(5) Etching of nanometer to micron scale features in materials.
(6) Deposition of nanometer to micron thick coatings.
The six applications listed above are presented approximately in
order of the time it takes to accomplish the task. Cleaning can take a
short or long time depending on the amount of contaminant on the
surface. “Gross contamination” corresponds to organic layers that are
more than a micron thick. This type of contamination is best handled by
aqueous washing or solvent rinsing. An exception to this rule is
photoresist film removal, which is a standard plasma process carried out
by the semiconductor industry. “Fine contamination” is present on all
surfaces, even after those recently cleaned. This last layer on the
surface is best removed by plasma, and it takes on the order of 0.1 to
10.0 seconds to complete.
Surface activation for wetting is the process of putting specific
chemical groups on a material surface to precisely fix its energy.
Wetting refers to the spreading of water droplets onto a surface to make
a continuous film. If there is a low surface energy, droplets will not
spread out, and the water contact angle between the droplet and the
surface will be high, ~90o. By contrast, if the surface
energy is high (say 70 dynes-cm), the droplets spread out and merge
together easily, with the water contract angle below 20o.
Wetting is necessary in some industries, such as printing, to get the
desired coverage of the fluid on the solid surface. Putting functional
groups down on a surface is a fast process, because only one atomic
layer is being changed. This process is completed in the millisecond to
second time range.
Surface activation for adhesion is also the process of putting
specific chemical groups on a material surface, but this time the goal
is to achieve strong bonds between the surface and an adhesive or glue.
As stated by Dr Mittal, “the strength of an adhesive bond increases
with the quality and quantity of connections made at the interface.”
Since here as well we are only affecting roughly one atomic layer of the
material, this process is fast, and can be completed in the millisecond
to second time range. If cleaning to remove fine contamination is
required prior to activating the surface, then the process time can
increases to tens of seconds. Adhesively joining materials is
ubiquitous in manufacturing, cutting across many industries from
automotive and aerospace to packaging and electronics. This is by far
the largest industrial application of plasmas.
Sterilization is at present a relatively small application of ionized
gas discharges. Here we are killing microorganisms prior to packaging
products which are destined for human consumption, either, food, drugs,
medical devices, medical instrumentation, etc. If the microorganisms
are present on the product in thick film form than washing is probably
the most effective cleaning route. However, if you need to make sure
that every last bug is killed down to the last layer on the surface,
then plasma sterilization is a good way to go. This process takes
several seconds to several minutes to complete. In this case, the job
is finished when less than one biological organism remains out of more
than a million that were present initially.
Etching nanometer to micron scale features on a surface is a crucial
step in manufacturing integrated circuits, flat panel displays,
microelectromechanical systems, and other microelectronic devices.
Vacuum plasmas are uniquely capable of etching these features, because
one can direct the positively charge ions in the gas to bombard the
surface with high energy, such that trenches with straight sidewalls are
generated in the material. Blanket etching is possible as well, as in
the case of photoresist removal. However, this process is relatively
slow taking from a minute to as much as an hour to finish.
The last important application is the deposition onto materials of
nanometer to micron thick coatings. Thin film deposition is another
crucial step in manufacturing integrated circuits, flat panel displays,
microelectromechanical systems, medical devices, etc. Plasmas are very
valuable tools for this process, because they enable the coatings to be
laid down at low temperatures where no thermal damage to the expensive
electronic device can occur. Since this process usually requires
depositing many thousands of layers of atoms on the material one atomic
layer at a time, it is a relatively slow process taking from a minute up
to an hour to complete.
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